Search
Close this search box.

Texturing Load-and-Unload Automation

Texturing Load-and-Unload Automation

Texturing Load-and-Unload Automation

Parameter
  • ModelLBA18000
  • ThroughputNett throughput ≥18000 pcs/hour
  • Uptime≥99%
  • Breakage≤0.01
  • Wafer traceabilityAccuracy>99.9%
  • Wafer Size18X±0.5mm*18X±0.5mm 210±0.5mm*210±0.5mm
  • Optional1. Microcrack detection 2. Wafer overlap detection 3. incoming breakage optical detection 4. unloading chemical stain optical detection
Highlights
  • High stability with Bernouli picker system
  • High flexibility and accuracy with 6-axis robot for cassette pick-and-place
  • Stand-alone smart system for live monitoring of various key index: output, OEE.
  • Compatible with AGV,RFID,Optional MES function
  • High tolerance with warped cells, suitable for BC solar cells