Parameter

• Throughput1. ≥3600pcs/h@91x182mm/single laser head (relevant to pattern) 2. ≥3600pcs/h@182x182mm (relevant to pattern)
• Uptime≥98.5%
• Breakage ≤0.02%@182mm，≤0.03%@210mm
• Loader fragment detectionIndustry-grade camera， 20M pixels(typical)
• Pattern compatability Comply with plt;dxf;dwg format
• Wafer size compatibility1. Length 91-105mm，Width 182-210mm，Thickness 90-220μm 2. 182-210mm，Thickness 90-220μm
• Spot size150-300μm（selectable）
• Laser parameter ≥90W@300k@532nm@＜15P
• Power stability ≤2%
• Pattern precision ±15μm
• Repeatability ±10μm
• Method Scanning
• Dimension 5560x4000x2800mm (A/B side)
• Upstream Integration Offline/Inline (Depending on customer’s requirement)
• Applicable xBC full/half-cut