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B DIFF/P DIFF/Oxidation/LP Load-and-Unload Automation

B DIFF/P DIFF/Oxidation/LP Load-and-Unload Automation

B DIFF/P DIFF/Oxidation/LP Load-and-Unload Automation

Parameter
  • ModelLOA12000GL
  • ThroughputFull cell 12000pcs/H,Half-cut 22000pcs/H
  • Uptime≥99%
  • Breakage≤0.01%
  • Wafer Load18X~23X(Square or rectangular)/compatible with half-cut 18X*91、210*105
  • Optional1. Incoming cassette breakage detection 2. Quartz boat breakage detection 3. Sheet resistance measurement 4.Film thickness measurement
Highlights
  • Gantry-type wafer loading and unloading system + six-axis robot arm to transport cassettes, dual working stations to switch between loading and unloading wafers for high production capacity;
  • Standardized modular programming, comprehensive detection and alarm system to ease the troubleshooting process
  • Contact parts such as suction cups, stoppers made of special materials and processing techniques to reduce damage on the silicon wafer
  • Compatible with manual and AGV load-and-unload, optional MES function.
  • High tolerance with warped cells, suitable for BC solar cells