Atomic Layer Deposition System

Atomic Layer Deposition System

Description

Deposition of the film is formed via alternately pulsing the vapor-phase precursor into the reactor. Applicable for TOPCon solar cells.

Parameter

Uptime＞99%
Inner Chamber Diameter550*420mm
Dual boat capacity3284/3712 pcs
Wafer SizeCompatible with various wafer sizes 182-230mm
Non-uniformitywithin-wafer & WtW &RtR ≤4%
Temperature range150-350℃
COnfigurationSingle loading/double loading

Highlights

Higher output with both lanes to operate independently
Simple upgrades to accomodate large wafer size
Maintenance friendly machine design
Dual chamber seal for better film uniformity performance
Minimal process gas wastage with high precision MFC gas control

Typical ALD film thickness of Top Aluminium boat

Typical ALD film thickness of Bottom Aluminium boat