Parameter

• Function1.Poly thickness reduction/removal; 2. Poly Oxidization
• Throughput1.18X≥4800pcs/h，210≥4000psc/h; 2. 18X≥9000pcs/h，210≥9000psc/h
• Uptime ≥99%
• Breakage 18X≤0.02%，210≤0.03%
• MTBF ≥800h
• MTTR ≤1h
• Compatible wafer size 182-210mm
• COmpatible wafer thickness 110-180μm
• Laser Power ≥90W
• Power stability ≤1%
• Pattern precision ±15μm
• Repeatability ±10μm
• Method Scanning
• Dimension 5560x4000x2800mm（A/B side）
• Upstream Integration Offline/Inline（ Depending on customer’s requirement）
• Applicable TOPCon solar cell

Process Overview